Factory Show
 
     
     
     
     
     
 
     
     
     
     
     
 
     
     
     
     
     
Production Process
• Synthetic quartz material--> cut--> round--> lapping--> polish--> frequency sorting--> clean--> electrode--> mounting--> baking--> frequency adjust --> seal
--> environment test--> final test--> packing and shipping.
| Process | Process Drawing | Description of Process | 
|---|---|---|
| Cutting |   | With the r-surface of a lumbered crystal used as the reference. Wafer-shaped pieces are cut out at the prescribed angle. | 
| Measurement of angle |  | To confirm that the crystal is cut at the prescribed angle, the angle is measured by means of an X-ray angle checker. | 
| Precision lapping |  | Since frequency of AT-cut crystals is deter-mined by the thickness of the crystal piece, the thickness of the crystal pieces is made uniform by means of a surface lapping machine to raise the surface accuracy. | 
| Profiling |  | To prevent joining with other vibration modes and from being influenced by sub-vibrations, the external shape is properly corrected by profiling. | 
| Bevel |  | To cause vibrations to occur at the center, the crystal piece is shaped into the form of a lens. | 
| Etching & cleaning |  | After removing the worked layer produced by precision lapping and beveling by etching, cleaning is carried out. | 
| Electrode metal deposition |  | The electrode used for applying a electric field to the crystal piece is formed by vacuum metal deposition (Ag,etc.) on top of the crystal piece. | 
| Assembly |  | The crystal piece is secured to the base by such means as Ag paste, or soldering. | 
| Fine frequency adjustment |  | Final fine adjustment of the frequency is carried out, by performing vacuum metal deposition again while letting the crystal oscillate. | 
| Sealing |  | To suppress aging of the crystal piece, the inside of the holder is first made vacuum, or filled with such inactive gas N2, and then sealed with a cap. | 
| Completion inspection | The crystal pieces are inspected for their specifications including frequency deviation, frequency vs, temperature characteristics, equivalent resistance, hermetical of seal and insulating properties. | 




 
    



