공장 쇼
생산 과정
• 합성 석영 소재--> 절단--> 둥글게--> 래핑--> 연마--> 주파수 정렬--> 세척--> 전극--> 장착--> 베이킹--> 주파수 조정 --> 밀봉
--> 환경 테스트--> 최종 테스트--> 포장 및 배송.
| Process | Process Drawing | Description of Process |
|---|---|---|
Cutting |
|
With the r-surface of a lumbered crystal used as the reference. Wafer-shaped pieces are cut out at the prescribed angle. |
Measurement of angle |
 |
To confirm that the crystal is cut at the prescribed angle, the angle is measured by means of an X-ray angle checker. |
Precision lapping |
 |
Since frequency of AT-cut crystals is deter-mined by the thickness of the crystal piece, the thickness of the crystal pieces is made uniform by means of a surface lapping machine to raise the surface accuracy. |
Profiling |
 |
To prevent joining with other vibration modes and from being influenced by sub-vibrations, the external shape is properly corrected by profiling. |
Bevel |
 |
To cause vibrations to occur at the center, the crystal piece is shaped into the form of a lens. |
Etching & cleaning |
 |
After removing the worked layer produced by precision lapping and beveling by etching, cleaning is carried out. |
Electrode metal deposition |
 |
The electrode used for applying a electric field to the crystal piece is formed by vacuum metal deposition (Ag,etc.) on top of the crystal piece. |
Assembly |
 |
The crystal piece is secured to the base by such means as Ag paste, or soldering. |
Fine frequency adjustment |
 |
Final fine adjustment of the frequency is carried out, by performing vacuum metal deposition again while letting the crystal oscillate. |
Sealing |
 |
To suppress aging of the crystal piece, the inside of the holder is first made vacuum, or filled with such inactive gas N2, and then sealed with a cap. |
Completion inspection |
The crystal pieces are inspected for their specifications including frequency deviation, frequency vs, temperature characteristics, equivalent resistance, hermetical of seal and insulating properties. |